MatriX Bond Adhesive Technology
Our adhesives offer state of the art Latent Cure Technology (LCT). MatriX Bond formulations allow for easy application to your components. An easy to control drying cycle, allows MatriX Materials to reproducibly process your components and ship to your facility with no tack or sticking of parts. All you need to do is assemble, apply pressure and cure.
A tack free surface allows for easy repositioning at room temperature to ensure your assembly is aligned before you cure it. If you need to pre-tack your component assembly, then just heat to 90° Celsius and MatriX Bond will melt and tack in place.
Formulated For Decades Of Service
Once sealed, MatriX Bond adhesives will endure decades of service. Designed to withstand extreme environments from space applications to oceanic environments; cell phone towers to handheld devices. MatriX Bond will survive solder reflow profiles up to 285° Celsius.